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Epoxy Resin Adhesive Series
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Detailed information
Core advantages
- Outstanding bonding strength: It exhibits excellent adhesion to a wide range of hard substrates, including most metals, ceramics, glass, and stone. After curing, the adhesive layer forms a tight bond with the substrate, providing stable structural support and resisting delamination even under stress conditions.
- Excellent chemical stability: After curing, the adhesive layer forms a dense structure that resists erosion from common acids, bases, organic solvents, and oil contaminants. It maintains stable performance even in special environments such as chemical plants and laboratories, thereby minimizing the impact of chemical media on bonding effectiveness.
- Excellent dimensional stability: The material exhibits low shrinkage during curing, and the cured adhesive layer is less likely to develop internal stresses due to shrinkage. This effectively ensures the assembly accuracy of bonded components, making it ideal for precision manufacturing applications with stringent dimensional requirements.
- Reliable mechanical performance: After curing, the adhesive layer exhibits high hardness and well-balanced resistance to compression, tension, and shear. It can withstand certain mechanical loads, providing reliable mechanical support for bonded joints and extending the service life of the product.
- Highly customizable formulation: By combining different types of curing agents, diluents, and fillers, the viscosity, curing speed, temperature resistance, and other properties of the adhesive can be flexibly adjusted to meet a wide range of construction and application requirements.
Highlight advantages
- Diverse bonding mechanisms: Beyond relying solely on physical adsorption, the active functional groups in its molecular structure can also undergo chemical reactions with hydroxyl and amino groups on the substrate surface, forming chemical bonds. As a result, the bonding stability of this adhesive surpasses that of adhesives based purely on physical adhesion.
- Wide temperature resistance range: After optimization through a special formulation, some products can withstand temperature fluctuations from -50℃ to over 200℃. They are suitable for both low-temperature storage environments and high-temperature operating conditions, offering a flexible temperature application range.
- Compatible with precision manufacturing processes: Some low-viscosity models exhibit excellent permeability, enabling them to penetrate even the tiniest gaps for reliable bonding. Moreover, after curing, the adhesive layer is smooth and uniform, with minimal risk of bubble formation, making it ideal for applications that demand high process accuracy, such as encapsulation of electronic components and assembly of precision instruments.
- Excellent environmental friendliness and controllability: With advancements in technology, low-volatility organic compound (VOC)-free and solvent-free epoxy resin adhesives have become relatively mature, meeting the environmental standards of most industries and enhancing safety when used in applications such as interior decoration and food-contact packaging.
Main application scenarios
1. Electronics and Electrical Industry
Widely used for encapsulation, fixation, and insulation of electronic components—for example, bonding integrated circuit chips and securing components on circuit boards. Its excellent insulation properties and temperature resistance can protect electronic components from the effects of moisture, vibration, and high temperatures. It is also employed in potting motors and transformers, enhancing the stability and service life of electrical equipment.
2. Architecture and Civil Engineering Industry
It is used for the reinforcement and repair of building structures, such as strengthening concrete beams and columns and injecting grout to repair cracks. Its high-strength bonding performance can effectively enhance the structural load-bearing capacity. In dry-hanging construction of stone and tiles, it serves as a structural adhesive, ensuring a firm bond between the stone material and the substrate while accommodating minor deformations in the building structure.
3. Mechanical Manufacturing Industry
Suitable for bonding and assembling metal components, such as securing bearings to shaft sleeves, joining machine tool guideways, and repairing damaged mechanical parts, this product’s high shear strength can replace certain welding and bolted-connection processes, reducing component weight and lowering manufacturing costs. It is also widely used in mold making, serving as a mold adhesive for producing precision molds.
4. Aerospace and Rail Transit Industry
It is used for bonding structural components in aircraft, spacecraft, and rail transit vehicles—for example, joining composite materials in aircraft fuselages and securing interior trim components in high-speed train carriages. Thanks to its lightweight nature, high strength, and resistance to extreme environments, this material meets the dual demands of transportation equipment: weight reduction and enhanced reliability.
5. Stone and Decoration Industry
As a stone adhesive and dry-hanging sealant, it is used for the jointing, repair, and installation of natural stones such as marble and granite. After bonding, the adhesive layer can be matched in color to the stone, without compromising the decorative effect. It is also suitable for sealing and bonding glass curtain walls, balancing both bonding strength and aesthetic appeal.
6. Composite Materials Industry
It is a key adhesive used in composite material molding, employed for impregnating and bonding reinforcing materials such as glass fiber and carbon fiber to produce high-strength composite components. This adhesive finds wide application in fields including sporting goods (such as golf clubs and fishing rods), housings for new-energy batteries, and marine structural components.
Keywords:
Epoxy Resin Adhesive Series
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